**DIASEMI DiaCu™ Diamond-Copper Composite The Ultimate Thermal Interface Material for High-Performance Applications** DIASEMI, a leading innovator in MPCVD diamond materials, introduces DiaCu™ Diamond-Copper Composite—a next-generation thermal interface material (TIM) engineered for exceptional thermal management in the most demanding applications. Product Specifications • Material: Advanced diamond–copper hybrid composite • Key Properties: Ultra-high thermal conductivity, low density, high mechanical strength Key Features ✔ Exceptional Thermal Conductivity – Combines diamond’s superior heat spreading with copper’s efficient heat dissipation for high-power devices ✔ Lightweight & Durable – Low density with an outstanding strength-to-weight ratio for performance-critical systems ✔ Enhanced Mechanical Strength – Diamond reinforcement provides excellent hardness and long-term reliability ✔ Corrosion & Oxidation Resistance – Stable performance in harsh and high-temperature en...