DIASEMI DiaCu™ Diamond-Copper Composite

   **DIASEMI DiaCu™ Diamond-Copper Composite

The Ultimate Thermal Interface Material for High-Performance Applications**

DIASEMI, a leading innovator in MPCVD diamond materials, introduces DiaCu™ Diamond-Copper Composite—a next-generation thermal interface material (TIM) engineered for exceptional thermal management in the most demanding applications.

Product Specifications

• Material: Advanced diamond–copper hybrid composite

• Key Properties: Ultra-high thermal conductivity, low density, high mechanical strength

Key Features

✔ Exceptional Thermal Conductivity – Combines diamond’s superior heat spreading with copper’s efficient heat dissipation for high-power devices

✔ Lightweight & Durable – Low density with an outstanding strength-to-weight ratio for performance-critical systems

✔ Enhanced Mechanical Strength – Diamond reinforcement provides excellent hardness and long-term reliability

✔ Corrosion & Oxidation Resistance – Stable performance in harsh and high-temperature environments

Applications

DiaCu™ is an ideal TIM solution for:

• Semiconductor Devices – High-power electronics and advanced packaging

• THz & Microwave Systems – Reliable thermal control for high-frequency operation

• Laser & Photonics – Efficient heat dissipation for high-power laser diodes

• Medical & Aerospace Equipment – Mission-critical thermal management

With DiaCu™, DIASEMI sets a new benchmark in thermal conductivity, lightweight performance, and durability, redefining advanced thermal management materials.

📩 Contact: sales@semixicon.com

🌐 Learn more: www.diasemi.us

#ThermalInterfaceMaterial #DiamondCopperComposite #HighThermalConductivity #MPCVDDiamond #SemiconductorCooling #AdvancedThermalManagement #HighPowerElectronics

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